21 fp-10 sl su series cic t ype 1.0mm pitch (smt) p.c. board dimension applicable fpc dimension (t=0.3?.05) no. of pins a b c d no. of pins a b c d 04 3.0 5.1 9.7 4.5 17 16.0 18.1 22.7 17.5 05 4.0 6.1 10.7 5.5 18 17.0 19.1 23.7 18.5 06 5.0 7.1 11.7 6.5 19 18.0 20.1 24.7 19.5 07 6.0 8.1 12.7 7.5 20 19.0 21.1 25.7 20.5 08 7.0 9.1 13.7 8.5 21 20.0 22.1 26.7 21.5 09 8.0 10.1 14.7 9.5 22 21.0 23.1 27.7 22.5 10 9.0 11.1 15.7 10.5 24 23.0 25.1 29.7 24.5 11 10.0 12.1 16.7 11.5 26 25.0 27.1 31.7 26.5 12 11.0 13.1 17.7 12.5 28 27.0 29.1 33.7 28.5 13 12.0 14.1 18.7 13.5 14 13.0 15.1 19.7 14.5 15 14.0 16.1 20.7 15.5 29 28.0 30.1 34.7 29.5 16 15.0 17.1 21.7 16.5 30 29.0 31.1 35.7 30.5 su series cfp24 -0150f (upper contact type) no. of pins features 1. fpc connector usable with cic (carbon in circuit) printing. 2. either upper or lower contact location available. 3. low profile of 2.4mm height when mounted. 4. using the zif structure. 5. supplied in the embossed taping with automatic mounter. specifications 1. rating : 0.5a, 100v ac/dc 2. contact resistance : 30m ? max. 3. insulation resistance : 500m ? min. at 500v dc 4. withstanding voltage : 500v ac (for one minute) 5. operating temperature range : ?0?c to +85?c material and plating housing : thermoplastic resin, natural color, 94v-0 cover : thermoplastic resin, natural color, 94v-0 contact : cu alloy, au plating hold down : cu alloy, sn-cu plating 1.0(spacing) 5.2 (2.0) 1.7 0.3 2.4 2.4 d 1.0 b c a 1.5 3.4 0.5 2.4 3.0 0.25 2.0 2.6 a 1.0 (d 0.6) 0.5 4.0 min. silver ink/carbon paste : 10 m min. r0.4 (a 2) a 1.0 0.7 1.0 sl series cfp25 -0150f (lower contact type) no. of pins 1.0(spacing) 5.2 (2.0) 1.7 0.3 2.4 d 1.0 b c a 1.5 3.4 2.4 fpc connectors fpc plating to recommend : au plating
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